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DL QCM1255 R7-8700GE 16 512 W11P

Cod: BTO509_QCM1255_EMEA

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DL QCM1255 R7-8700GE 16 512 W11P

Built-in speaker(s)

Yes

Total carbon emissions, standard deviation (kg of CO2e)

PAIA version

GaBi version 1, 2024

Total carbon footprint (kg of CO2e)

92.7

Carbon emissions, manufacturing (kg of CO2e)

46.5354

Carbon emissions, logistics (kg of CO2e)

2.2248

Carbon emissions, energy usage (kg of CO2e)

43.4763

Carbon emissions, end-of-life (kg of CO2e)

0.46

Total carbon emissions, w/o use phase (kg of CO2e)

49.2237

Processor model

8700GE

Operating system installed

Windows 11 Pro

Processor family

AMD Ryzen™ 7 PRO

Placement supported

Horizontal/Vertical

Cable lock slot type

Kensington

Cable lock slot

Yes

Product type

Mini PC

Chassis type

Micro PC

Product colour

Black

Display included

No

Power Supply

90 W

Audio Chip

Realtek ALC3204

Weight

1.39 kg

Memory slots

2x SO-DIMM

On-board GPU manufacturer

AMD

On-board graphics card model

AMD Radeon 780M

On-board graphics card family

AMD Radeon

On-board graphics card

Yes

Discrete graphics card

No

Discrete graphics card model

Not available

Memory data transfer rate

4800 MT/s

Maximum internal memory

64 GB

Internal memory type

DDR5-SDRAM

Memory layout (slots x size)

2 x 8 GB

Total storage capacity

512 GB

Bluetooth

Yes

WLAN controller model

MediaTek MT7925

Wi-FI

Yes

Antenna type

2x2

Ethernet LAN

Yes

Ethernet LAN data rates

10,100,1000 Mbit/s

Top Wi-Fi standard

Wi-Fi 7 (802.11be)

WLAN controller manufacturer

MediaTek

Cabling technology

10/100/1000Base-T(X)

Operating vibration

0.26 G

Non-operating vibration

1.37 G

Non-operating shock

105 G

Operating altitude

-15.2 - 3048 m

Non-operating altitude

-15.2 - 10668 m

Operating shock

40 G

Storage relative humidity (H-H)

5 - 95%

Storage temperature (T-T)

-40 - 65 °C

Operating temperature (T-T)

10 - 35 °C

Operating relative humidity (H-H)

20 - 80%

Cables included

AC

Audio output channels

4.0 channels

Trusted Platform Module (TPM)

Yes

Trusted Platform Module (TPM) version

2.0

Audio system

High Definition Audio

Motherboard chipset

AMD PRO 665

Ethernet LAN (RJ-45) ports

1

DC-in jack

Yes

USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity

1

HDMI ports quantity

1

HDMI version

2.1

Combo headphone/mic port

Yes

USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity

3

USB 2.0 ports quantity

2

DisplayPort version

1.4a

USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity

0

USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity

0

Thunderbolt 3 ports quantity

0

DisplayPorts quantity

1

Power supply input voltage

100 - 240 V

Power supply input frequency

50/60 Hz

Processor generation

AMD Ryzen PRO 8000 Series

Processor boost frequency

5.1 GHz

Processor base power

35 W

Number of processors installed

1

Processor threads

16

Processor cache type

L3

Processor manufacturer

AMD

Processor cache

16 MB

Processor cores

8

Processor frequency

3.6 GHz

Trial software

McAfee Business Protection 1-year,Microsoft Office Trial

Operating system architecture

64-bit

SSD interface

PCI Express

SSD capacity

512 GB

SSD form factor

M.2

NVMe

Yes

Storage media

SSD

Optical drive type

No

Total SSDs capacity

512 GB

Number of SSDs installed

1

SSD memory type

TLC

Number of storage drives installed

1

Doesn't contain

PVC/BFR

Width

36 mm

Height

182 mm

Depth

178 mm

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